Polyimide adhesive qualifies for high temperature work
Polytec EC P-690, described by Intertronics as a state-of-the-art polyimide adhesive from the Polytec PT range, has been qualified for high temperature die attach for operating temperatures up to 300°C.
In an application involving 1.4 mm chips, evaluation has proved the product had the highest die shear strength of all the polyimide adhesives tested.
Polyimide-based chemistry provides excellent thermal resistance, superior to other typical organic adhesives. Products in this range are characterised as modified polyimide single component, solvent containing adhesives and coatings which are applicable in the temperature range from 240°C to 500°C.
They are available as electrically conductive, thermally conductive and electrically highly insulating adhesives and coatings, optimised for dispensing, jet-dispensing and stamping techniques. They are also available as screen printable polyimides for the passivation of semiconductor surfaces.
The range consists of four specific products to suit varying demands of performance and processing characteristics on which the engineers at Intertronics can advise in relation to customer-specific situations.
