01 December 2009
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Low density potting epoxy saves weight

In many electronic applications the weight of potting electronics to protect components against mechanical shock or the environment can be a very significant part of the overall weight of installed equipment.

With this in mind, Intertronics has come up with a light-weight epoxy technology which brings the density of the potting material down to 0.6. Known as "adhere" IRS2012, the material is not only very light but is also RF transmissive and effectively transparent to radio signals. It also exhibits good electrical properties, low cure shrinkage and chemical resistance, which together make the material suitable for potting aerials and related equipment.

The black two-part material is available in twin pack sachets which can be mixed and transferred to a syringe for precision application if required.

Paul Gay


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