HLC technology is an adhesive platform that combines the qualities of anionic and free radical chemistries into one formulation. HLCs are said to exhibit the physical and performance properties of Dymax light-curable adhesives and the moisture/contact cure of anionics. The incorporation of contact curing enables instant bonding in dark areas and to a range of substrates, including opaque and light-blocking materials.
The first product in the series, HLC-M-1000 is suitable for bonding applications on catheters, tube sets, diagnostic and therapeutic devices, autoinjectors, and endoscopes. Its built-in moisture/contact cure feature enables complete adhesive curing in dark areas.
According to Dymax, HLC-M-1000 cures with broad-spectrum light and is LED optimised at 405 nm, and it can also cure at low intensity (~ 20 mW/cm2). The material begins to cure upon substrate contact, with the ability to expedite and improve the cure with light exposure. Other characteristics include a tack-free surface after light cure, a 3 cP wicking grade viscosity for very tight-fitting assemblies, and compatibility with many plastics and metals.
Dymax has also developed dispensing systems for these hybrid light-curable products to follow best dispensation practices. The systems limit potential issues associated with down packing, such as premature cure inside fluid lines and packaging caused by foreign matter or accidental air (moisture) exposure that can cause accelerated aging, and also prevents bubbles. Users can choose from various controllers, valves, material reservoirs, and pressure tanks to create configurations that meet their manufacturing needs. These complete systems enable precise, contaminate-free dispensing of HLC materials onto components.
A team of Dymax application engineers and system integrators are available to answer technical questions about HLC technology, customise dispense solutions, assist with material handling challenges and support customers throughout the life of their manufacturing process.
Additional HLC materials for medical devices and industrial applications will be released later this year.
