Thermally conductive encapsulants boast flexibility
1 min read
Formulated for electrical potting and encapsulation applications, Master Bond EP36AO combines high thermal conductivity with thermal stability and this flexible, heat resistant epoxy is claimed to have superior mechanical properties.
Serviceable over the wide temperature range of -80°F to +500°F, EP36AO provides high performance in harsh conditions. Once cured, it features solid electrical characteristics including a dielectric strength of 400 volts/mil, a volume resistivity of 2-3 x 1012 ohm-cm and has a coefficient of thermal expansion exceeding 75 in/in x 10-6/°C at 60°C and a tensile strength of over 2,000 psi.
The material is a capable adhesive and coating that adheres well to both metallic and non-metallic substrates and it features long-term chemical resistance to an array of organic and inorganic chemicals. As a one component system, EP36AO doesn't require any mixing and offers the convenience of flexible cure schedules.
A typical gel time is 30 minutes at 180°F, with full cures attained in 2-2½ hours at 300°F. But this can be shortened further at higher temperatures. EP36AO will retain its liquidity as long as the temperature does not exceeed 180°F.
