Cryogenically serviceable epoxy adhesive meets NASA low out gassing specs
Master Bond's recently launched two part epoxy adhesive/sealant is specially formulated for demanding applications where factors like temperature cycling, high vibration, and mechanical shock are an issue.
EP21TDCHT-LO withstands cryogenic temperatures and meets NASA low out gassing specifications and can be used for a wide variety of structural, electronic, aerospace, medical, and oil & chemical processing applications.
The material has a convenient mix ratio of 1:1 by weight or volume and is formulated to cure at room temperature or more rapidly at elevated temperatures.
Master Bond tell us that as a toughened system, it is particularly well suited for bonding dissimilar substrates, especially when they have differing coefficients of expansion. It has an outstanding service temperature range from 4K to +350ºF. Other notable features include high shear and peel strength and a Shore D hardness better than 60. The cured epoxy also has good chemical resistance and is an electrical insulator.
