Master Bond launches thermally-conductive, electrically-insulating epoxy

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Master Bond EP40TC is a two-part epoxy system designed for bonding, sealing and encapsulating applications where thermal conductivity and electrical insulation are required.

With a high thermal conductivity value of 8-11 BTU•in/(ft2hr°F) [1.16-1.60 W/(mK)], it is formulated with a small particle size filler said to make it suitable for filling small cavities and applying the product in thin sections. Its volume resistivity is greater than 1015 ohm-cm.

“EP40TC’s key distinguishing factor is that there is no compromise on the bond strength while providing excellent elongation and toughness. It has a high strength profile with a tensile lap shear strength of 2,300-2,500 psi, an elongation of 60-70%, and a tensile modulus of 5,000-15,000 psi,” says Rohit Ramnath, senior product engineer. “Also, it meets NASA low outgassing specifications which is a prerequisite for many aerospace, electronic, and optical applications.”

Serviceable from -100°F to +300°F, this toughened system resists thermal cycling, vibration and shock. EP40TC is said to exhibit a high peel strength of 40-60 pli and Shore D hardness of 70-80 at 75°F. It features a convenient 1:1 mix ratio, and cures in two to three days at room temperature or faster with the addition of heat. This compound adheres well to a variety of substrates such as metals, composites, glass, and many plastics. EP40TC is available in standard packaging, as well as premixed and frozen syringes.