01 June 2011
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Electronic device packaging workshop

UK Microelectronics Packaging Society (IMAPS-UK) has announces details its Basic Packaging Workshop being held at the Welding Institute next week on 21 and 22 June 2011.

Selection of the correct joining process and materials for advanced electronic device packaging for microelectronics and semiconductors is critical for electrical functionality, mechanical integrity and overall reliability. The Basic Packaging Workshop will provide delegates with an insight into this grounding breaking technology, its business drivers and assembly techniques from the specialists: IMAPS-UK, the United Kingdom Chapter of the International Microelectronics & Packaging Society.

Day one is a Technical Seminar providing presentations on various aspects of the technology and day two is a hands-on practical workshop giving introductory training on two selected topic areas – Wire bonding and Epoxy Adhesives.

The event is open to all, including non IMAPS-UK members and further details can be found by visiting the Societies website www.imaps.org.uk or by emailing the events coordinator: bpw-event@imaps.org.uk

Author
Paul Gay

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