Low-shrinkage, moisture and thermally-resistant, it can improve efficiency and reduce costs. Also suitable for component sealing and encapsulation. Fluoresces under low intensity black light for inline bond inspection.
Adhesive cures with UV and moisture to bond in part-shadow areas
Dymax 3401 from Intertronics enables rapid cure bonding of a wide variety of plastics (including ABS and PC), metal and glass, in part-shadow areas. UV light achieves cures of a second or less depending on application and process, followed by secondary moisture activation which completes curing in shadow areas.
