Solvay expands FusePly range 

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Solvay has expanded its range of chemical bonding technology with the launch of FusePly 250, a product designed to bond composite structures at 250°F and higher.

Microscopic view of FusePly resin (at the interface with prepreg and adhesive) ingressing into the composite panel during co-cure (as indicated by discoloured composite layers) and delivering a chemically bonded interface between FusePly and adhesive. (Photo: Solvay, PR095)
Microscopic view of FusePly resin (at the interface with prepreg and adhesive) ingressing into the composite panel during co-cure (as indicated by discoloured composite layers) and delivering a chemically bonded interface between FusePly and adhesive. (Photo: Solvay, PR095) - (Image credit: Solvay)
The new product is said to complement the previous FusePly 100 grade, introduced in 2018, which has now been renamed FusePly 350 to reflect its compatibility with 350°F cure film adhesives.

Both grades can be integrated into existing manufacturing processes as an upgrade for traditional surface preparation methods.
FusePly is a composite bonding technology resulting in covalent bonds between adhesives and composite structures. While it handles and processes like a conventional peel ply product, it is claimed to create a reliable chemically functionalised composite surface which eliminates time and labour-intensive surface preparation steps and assembly processes.

Stephen Heinz, vice president research and innovation for Solvay’s global composite materials business unit, said: “The reliability and robustness of bonded structures are a top priority for users of composites in safety critical applications in aerospace and other demanding markets. We developed FusePly, a fundamentally new bonding approach, to meet the needs of leading aircraft OEMs and enable them to take full advantage of composites for lighter, stronger structures.”