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Non-Drip Cryogenic Epoxy Offers Electrical and Thermal Insulation

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Master Bond has described its EP29LPSPND-3 as a two component, non-drip epoxy compound with a paste consistency that can be used for bonding and sealing applications.

(Image credit: Master Bond)
(Image credit: Master Bond)

The system is electrically non-conductive and thermally insulative, with a thermal conductivity of approximately 0.2 W/(m•K) at room temperature. It withstands cryogenic temperatures and is serviceable in the range from 4K to 250°F.

EP29LPSPND-3 features a coefficient of thermal expansion of 45-50 x 10-6 in/in/°C, a tensile strength of 6,000-8,000 psi, and a Shore D hardness of 70-80. This system has a volume resistivity exceeding 1015 ohm-cm at 75°F and a dielectric constant of 4.2 at 60 Hz. A key performance attribute is its ability to withstand temperature cycling even at cryogenic levels.

EP29LPSPND-3 has a mix ratio of 100:65 by weight with a long working life after mixing; a 100-gram batch will yield an open time of greater than five hours at 75°F. The colour of Part A is clear-translucent, and Part B is amber-clear; it cures clear when applied in thin sections despite being a paste, with a refractive index of 1.56 at 589 nm. The recommended cure schedule is either 12-18 hours at 130-150°F or a faster 5-10 hours at 150-165°F. EP29LPSPND-3 is available in ounce jar kits, half pint kits, pint kits, quart kits, and gallon kits.

Last November, Master Bond launched EP21LSCL-2Med for medical device applications, as a two component non-cytotoxic epoxy for bonding, sealing, coating and potting.

While most, if not all, epoxies will yellow over time, especially upon exposure to heat and intense UV light, EP21LSCL-2Med is expected to resist yellowing to a greater extent than conventional systems. This feature makes it ideal for imaging applications or other medical devices where optical clarity is needed.

EP21LSCL-2Med is an optically clear compound with a refractive index of 1.57. It has a high glass transition temperature of 110-120°C and a service temperature range of -60°F to +350°F (-52°C to +177°C). This system has a 100:20 mix ratio by weight and a low mixed viscosity of 600-900 cps at room temperature. It is a moderate heat cured epoxy which features a gel time of six to eight hours at room temperature for a 100-gram batch. EP21LSCL-2Med cures at room temperature followed by a post cure of 3-5 hours at 140-175°F (60-80°C).

EP21LSCL-2Med is said to adhere well to many substrates, including but not limited to metals, composites, glass, ceramics, and plastics. It offers a tensile strength of 8,000-9,000 psi and a tensile modulus of 325,000-375,000 psi. This epoxy is claimed to resist many sterilisation methods, such as steam sterilisation, liquid sterilants, anti-bacterial agents, and Ethylene Oxide