It is not premixed and frozen, and cures with heat. This dimensionally stable system is described as featuring excellent mechanical properties with both a high modulus and die shear strength. It transfers heat and resists thermo-mechanical stresses effectively.
EP17HTDA-2 has exceptional temperature resistance with a service temperature range of -62°C to +316°C and a Tg of 185-190°C. This compound has a thermal conductivity of 1.30-1.44 W/(m K), a low coefficient of thermal expansion, and is also electrically insulative, with a volume resistivity greater than 10^15 ohm-cm. It withstands a variety of chemicals including acids, bases, salts, fuels, oils, water and many solvents.
As a one-part system, EP17HTDA-2 does not require any mixing and is curable in the temperature range of 150-175°C for around 4-5 hours. To optimise properties, a post cure of 2-3 hours at 200°C is recommended. It bonds well to a wide variety of substrates, such as metals, ceramics, plastics and composites. Upon curing, it delivers a tensile modulus exceeding 1,100,000 psi and a die shear strength of 20-23 kg-f at room temperature (80 x 80mm). It also has minimal shrinkage upon curing.
While EP17HTDA-2 is suited to electronic and related applications, it can also be used in vacuum situations as it passes NASA low outgassing testing. It is a thixotropic paste, yet is available in 10cc and 30cc syringes for automated dispensing, and has a shelf life of 3-6 months when stored at 4-10°C.
