Epoxy offers high glass transition temperature

1 min read

MasterBond has described EP114 as a two component, low viscosity heat cured epoxy that can be utilised for underfill, coating, impregnating and porosity sealing applications.

(Image credit: Master Bond)

This optically clear compound is said to feature high dimensional stability due to its nano-silica filler material. It has been tested for abrasion resistance per ASTM D4060-14 and is expected to withstand 1,000 hours at 85°C and 85% relative humidity.

According to MasterBond, EP114 has excellent electrical insulation properties with a volume resistivity greater than 1014 ohm-cm and a dielectric constant of 3.35 (60Hz) at 25°C. This system features a low coefficient of thermal expansion of 20-22 x 10-6 in/in/°C along with a compressive strength of 24,000-26,000 psi, an ultra-high modulus of more than 1,000,000 psi and a hardness of 85-95 Shore D at 25°C. Also, it has a glass transition temperature of more than 200°C.

EP114 is claimed to feature excellent flow properties with a mixed viscosity of 500-1,500 cps. It is expected to offer a long working life after mixing, for example a 100-gram batch at 25°C will yield an open time of two to four days. The system requires heat for curing. One of the many recommended cure schedules is two to three hours at 125°C followed by five-eight hours at 150°C, with a two hour or longer post cure at 150-200°C. It is available in various packaging options: syringe kits, 1/2-pint kits, pint kits, and quart kits. It can also be packaged in pre-mixed and frozen syringes, which require storage at -40°C and are suitable for automated dispensing.