In doing so, they will be focusing on products for electrical and electronic applications as well as for e-mobility, sensors, lighting, rail and aerospace. This includes the complete Bergquist product range of thermally conductive materials.
Both manufacturers and customers benefit from the Bodo Möller Chemie Group’s consultation services offering guidance on selecting the optimum solution for their application. For thermal interface materials (TIM), Bodo Möller Chemie's own Cutting Competence Center is able to cut and imprint thermally conductive material in a single work step. The components are then tested and measured optically with a measuring microscope. During this process, virtually any contour and contour adjustment can be made as required thanks to digital cutting. Clients benefit from the supply of ready-to-use products such as Thermal GAP PAD, Thermal SIL PAD, Hi Flow phase change materials and Bond Ply, a double-sided adhesive solution for thermally stressed bonding. In addition to pre-plotted products, liquid materials are also available as thermal gap fillers.
Thanks to the extended collaboration with Henkel, Bodo Möller Chemie now also offers an adhesive solutions portfolio for the electronics industry with brands Loctite and Bergquist. Products range from potting compounds and electrically conductive adhesives through to underfills and thermally conductive solutions.
