Thermally conductive epoxy adhesive keeps its cool
As electronics miniaturise with higher circuit density, heat can become an unwanted by-product of the assembly process, which can only be dealt with by the adoption of thermally conductive adhesives.
The Polytec PT range from Intertronics meets this need in the form of a range of high technology single and two-part systems designed for applications where heat transfer is essential. These include chip bonding, heat sink bonding, thermistors, LED assembly and power semiconductor packaging. New applications in general electronics packaging, opto-electronics, hybrid microelectronics and automotive can also be catered for with specific formulations.
The Polytec PT epoxy range offers thermal conductivities up to 3 W.m-1.K-1 – significantly higher than more general industry norms. They are supplied in process convenient packaging, including twin packs or as premixed and frozen syringes, eliminating both mixing and mess.
On-site mixing options include the preeflow eco-duo 450 high precision dispensing system or the Thinky planetary mixing system which degasses and mixes in disposable containers for added convenience.
