New generation adhesives offer leadless component ruggedisation
With a particular focus toward harsh duty electronics, the specialists at Intertronics have recently introduced the next generation of fast room-temperature-cure electronics adhesives from sales partner Dymax.
The new 9422-SC, shown at the recent IASE exhibition, is a component ruggedising and staking material, engineered to hold critical components such as ball grid arrays (BGA) and video graphics arrays (VGA) for secondary processes or for long-term reliability.
The adhesive is engineered specifically for bonding of critical high value electronic components, ensuring that they stay exactly in place on printed circuit boards throughout manufacture, assembly qualification and service/operation for the full product lifecycle.
Peter Swanson, MD of Intertronics, explained: "DYMAX 9422-SC features a bead shape designed to wet both the board surface and the component edge without seeping into shadowed areas and is highly thixotropic for zero movement prior to cure, as well as being halogen and silicone free and RoHS compliant."
