Based on an epoxy adhesive, the 630μm reactive tape offers stability during curing and provides initial tack for ease of mounting. Heavy mountings remain in position during the warm-up phase of the curing process. Bonding with DuploTEC® 10630 SBF enables a fast, clean and precise assembly process and meets the automotive industry requirements in regard to torque, peel and shear forces, also passing the temperature and weathering tests.
The tape possesses the necessary flexibility after curing at 130-170°C compensating for thermal expansion of substrates. The innovative tape DuploTEC® 10630 SBF can be delivered as a die-cut.
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