01 December 2010
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Technical guide explains cure mechanisms in structural adhesive bonds

The engineers at Intertronics have noticed that the use of adhesives for structural bonding is on the increase and that there is a corresponding need for greater awareness of the issues involved.

To achieve a successful assembly, the adhesive must harden in the bondline to provide a joint which is capable of bearing the forces to which it is subjected for its lifetime, whatever environmental factors are thrown at it.

Understanding how this and many other home truths work is important both for adhesive selection and specification of the bonding process. The Technical Guide on Adhesive Cure Mechanisms has the answers and explains what the differing cure processes are and how they affect adhesive choice.

You can download it at www.intertronics.co.uk/general/bulletin.htm

Author
Paul Gay

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