Titled ‘Future Trends for Adhesives and Adhesion: From Biomimetics to Space Applications’, the event on 15 March is organised by the Society for Adhesion and Adhesives (part of the IOM3 Surface Engineering Division) and will be staged at the Society of Chemical Industry, 15 Belgrave Square, London.
This one-day seminar considers some of the more recent developments relating to adhesion and adhesives. The morning will begin with a look at bio-inspired functionality, including bio-adhesion, high-strength electrical conduction, self-healing, reworkable and disbondable joints.
In the afternoon, recent but available advances in UV LED curing technologies and adhesion promotion will be presented, ending with a look at the requirements for cryogenic applications to meet the increasing demand for extreme low-temperature resistance in power generation, medical and space applications.
Amongst the afternoon speakers will be Peter Swanson, MD of Intertronics, whose presentation is titled ‘Adhesives: the trend towards using UV LEDs for curing, with pros and cons’.
For more information and to book your place, contact David Tod, QinetiQ, on 01959 514492 or email him at datod@qinetiq.com.
