Located in Inseto’s new process development laboratory, along with materials test and plasma cleaning equipment, the automatic bonder is suitable for the large-wire, fine-wire and ribbon bonding of hybrid circuits, semiconductor devices, sensors and automotive power modules and battery packs.
Inseto has also launched two training courses: one for wedge bonding, the other for ribbon bonding. Both are delivered by Inseto engineers. Course content is tailored to meet a trainee’s exact requirements and modules include bond theory, bonding tool and wire/ribbon selection, machine setup and operation, process development and bond quality control, and maintenance and repair.
Matt Brown, Inseto’s Managing Director, comments: “These are challenging times for manufacturers. To take full advantage of industry’s latest manufacturing techniques companies must first develop and optimise their processes. They then need to ensure they’re getting the most from their equipment when they move into volume production. Early access to best-in-class equipment and thorough training for operators are therefore essential.”
Brown goes on say that most equipment distributors simply carry demo machines – on loan from their suppliers and which they intend to sell. Inseto, on the other hand, is investing in kitting out its own process development laboratory.
“Our laboratory is a quiet environment that doesn’t have distractions you find in a manufacturing environment. And with our specialists to hand, it’s the ideal place to build and evaluate prototypes, and to receive training.”
In addition, Inseto is exclusive distributor for Kulicke and Soffa’s range of wire bonding and die bonding equipment & materials in the UK, Ireland and Nordic regions.
