Easy and trustworthy access to SVHC-free adhesives made in the EU will become essential if, or more likely when, industry regulations come into force banning the manufacture of such products, the company says. Inseto has written a guide on this topic, via link below.
As DELO’s exclusive distributor in the UK & Ireland, Inseto can supply DELO MONOPOX GE6585 and GE6525, which are primarily used for dam & fill chip encapsulation, and DELO DUALBOND GE7065, which is mainly used for Glob Top chip encapsulation. All three cure to from rigid protective coatings and can be used for encapsulating not only semiconductor die but also sensors, which is a common practice in the automotive, aerospace and harsh environment industrial sectors, for example.
“Whilst not all chip encapsulation adhesives contain SVHCs, those that are needed to ensure high reliability do,” comments Eamonn Redmond, sales manager of Inseto. “And the European Chemical Association is constantly reviewing and working towards banning the use of SVHCs. Whilst it’s not certain when adhesives containing SVHCs will be banned, they almost certainly will be. In addition, these new adhesives offer significant processing and performance upgrades over their SVHC-containing counterparts.”
DELO MONOPOX GE6585, DELO MONOPOX GE6525 and DELO DUALBOND GE7065 are believed to be the first SVHC-free adhesives on the market for applications where high reliability is a necessity. They are offered as alternatives to existing DELO adhesives currently used for Dam & Fill and Glob Top chip encapsulation in applications where high reliability is important. All three new adhesives have high shear strengths, low coefficients of thermal expansion (CTE), high glass transition temperatures (Tg), extended operating temperature ranges and an extremely high resistance to chemicals. GE6585 and GE6525 are one-part heat-cured black epoxies.
Compared to their SHVC-containing counterparts, the CTE has been nearly halved. However, the new adhesives retain the high Tg of the existing adhesives (>170oC), making them ideal for high reliability applications; ensuring minimal risk of board warpage during assembly, according to Inseto. GE7065 is also a one-part heat-cured black epoxy with a low CTE and high Tg. It also has the added advantage of the option of being light-fixable immediately after dispensing. In addition, the filler particle size is significantly reduced (to around 7μm), allowing the adhesive to flow more easily between very fine-pitch wire bonds.
All three new adhesives boast significantly shorter curing times than their SVHC-containing counterparts - 30 minutes at 100oC for GE6585 and GE6525, and 60 minutes at 130oC for GE7065.
