Master Bond launches silver-filled, low-outgassing epoxy for EMI/RFI shielding

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Master Bond has launched EP4S-80, a single-component silver-filled epoxy which meets NASA low outgassing requirements.

It has an unlimited working life at room temperature and a moderate heat cure requirement of 80°C. With a viscosity of 10,000-15,000cPs, EP4S-80 is brushable, making it suitable for electromagnetic and radio frequency interference shielding and static dissipation. This formulation can also be used in a variety of applications where electrical conductivity is required: bonding, sealing, coating, as well as gap filling and encapsulating.

EP4S-80’s mechanical properties include a tensile modulus of 500,000-600,000psi and a compressive strength of 22,000-24,000psi at 25°C. This electrically-conductive system offers a volume resistivity of 0.02-0.06 Ohm-cm and a thermal conductivity of 1.30-1.44 W/(m•K). Upon curing, EP4S-80 offers low shrinkage,dimensional stability and a glass transition temperature of 130-135°C. Serviceable over the temperature range of -60°C to +150°C, this compound adheres well to a variety of substrates such as metals, composites, glass, ceramics, semiconductor materials and many plastics. It is packaged in ounce and pound jars.