01 December 2010
Sign up to our newsletterWant more news like this? Sign up to our newsletter.

Epoxy system is designed for electronic circuits

A highly thermally conductive epoxy system has been designed by Master Bond to help mitigate the issues associated with tightly packed components and miniaturised electronic circuits.

With a thermal conductivity over 22 BTU/in/ft²/hr/ºF and serviceability from -60 to 400°F, Master Bond EP21ANHT promises outstanding performance in demanding microelectronic applications.

This two component adhesive, sealant, and coating has a convenient 1 to 1 mix ratio by weight or volume and offers room temperature and faster elevated temperature cures. It is also a superior electrical insulator, which further expands its usefulness, claims the company. The product has a low coefficient of thermal expansion of 18-20 in/in x 10-6/ºC, a dielectric strength of >400 volts/mil, and a tensile shear strength greater than 1,000 psi. It resists a wide range of chemicals and adheres well to a variety of substrates.

The system is available in pint, quart, gallon and 5 gallon kits.

Author
Paul Gay

Comments

Do you have any comments about this article?

Name
 
Email
 
Comments
 

Your comments/feedback may be edited prior to publishing. Not all entries will be published.
Please view our Terms and Conditions before leaving a comment.

Similar Articles

New adhesives and coatings

Techsil has concluded an agreement to supply Canadian-based M.G. Chemicals’ high performance range of adhesives, sealants, coatings and cleaners to the UK’s electronics ...

Lightweighting challenge met

Dow Automotive Systems has developed a number of CAE material models, enabling the virtual validation of different adhesive solutions as joining technology in lightweight design.

Epoxy adhesive is dual curing

German adhesive manufacturer Panacol-Elosol has launched a dual cure epoxy adhesive intended for use in electronics assembly.

Robnor ResinLab

Robnor ResinLab has launched PX901C: a new epoxy resin that is said to have exceptional heat resistance and dimensional stability.

Some like it hot!

Everyone seems to be demanding high performance at higher temperatures from adhesives. But that can come at a price

The Light touch

For the uninitiated, selecting and using adhesives for a manufacturing process can be a daunting prospect. How on earth are you supposed to know which one is most suitable for ...

MULTI-LAYER MATERIAL OFFERS

Available through sole UK and European distributor Lohmann is Cirlex®, an ultra-high performance material for electrical isolation, thermal barriers and a variety of other ...

Epoxy-Tapes

The developments in automotive lightweight construction with a variety of different material combinations, the trend towards electro mobility and the need to save weight always ...

mounting applications

tesa has launched its first residue-free single-use removable foam adhesive tape, optimising processing and performance in a range of applications. The newly developed tesa® 65610 ...