01 December 2010
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Epoxy system is designed for electronic circuits

A highly thermally conductive epoxy system has been designed by Master Bond to help mitigate the issues associated with tightly packed components and miniaturised electronic circuits.

With a thermal conductivity over 22 BTU/in/ft²/hr/ºF and serviceability from -60 to 400°F, Master Bond EP21ANHT promises outstanding performance in demanding microelectronic applications.

This two component adhesive, sealant, and coating has a convenient 1 to 1 mix ratio by weight or volume and offers room temperature and faster elevated temperature cures. It is also a superior electrical insulator, which further expands its usefulness, claims the company. The product has a low coefficient of thermal expansion of 18-20 in/in x 10-6/ºC, a dielectric strength of >400 volts/mil, and a tensile shear strength greater than 1,000 psi. It resists a wide range of chemicals and adheres well to a variety of substrates.

The system is available in pint, quart, gallon and 5 gallon kits.

Author
Paul Gay

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