Electrically conductive adhesive suits electronics assembly

Polytec EC 275 has innovative specialist fillers which deliver excellent electrical within a low cost, two component formulation for applications in electronics, micro-electronics, opto-electronics, hybrids and sensor technology. The product can be used for IC packaging, connecting circuits to copper coils (RFIDs or smart cards) and EMI/RF shielding. The paste-like adhesive can be easily applied with various dispensing techniques or screen printing and is available either as two components or premixed and frozen in syringes. Managing director Peter Swanson explained: "Polytec EC 275 utilises nickel free fillers not based on silver flake to create an electrically conductive performance appropriate for die attach, SMD bonding, RFID antennas, and EMI/RFI shielding applications. Polytec EC 275 is substantially less expensive than conventional silver loaded adhesives, which are subject to volatile precious metal markets, but still offers comparable electrical performance." The material is easy to process due to convenience packaging, and it has a pot life of two days at room temperature, thus conferring process flexibility while minimising waste, Swanson claimed.