Fast cure potting silicone for elastic bonding and sealing

Good gap filling and sealing capacity, high durability and resistance to humidity and UV radiation are the qualities that a recently launched fast curing alkoxy silicone brings to electronic component assembly. Typical applications are in the production of solar and lighting systems, illuminated signage, switches and electronic connectors.

Loctite Si 5611 is a two-part, low viscosity silicone, designed for both bonding and sealing. The basic resin is a white liquid and the hardener is black, creating a grey liquid when combined. A cartridge press gun with mixing nozzle ensures the efficiency of this process; standard and customised automatic dispensing equipment is also available.

The product is also self-levelling it is particularly useful as a potting silicone to protect electronic components, increasing the quality and span of their service life. Service temperature is said to up to 200oC.

The new formulation has been designed for applications that require a fast cure at room temperature. For example, a full strength bond on aluminium can be typically achieved in 12 minutes on a 0.13mm gap.