14 October 2016
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Dual Action adhesive tape for multi-materials

Tecman, manufacturer and converter of self-adhesive materials, has developed what it says is its most advanced technology to date: DAAT Dual Action Adhesive Tape

The structural adhesive film has been formulated to meet the increasingly complex field of structural bonding of multi-materials, with a cured shear adhesion of up to 39.8 MPa.

DAAT technology incorporates the benefits of conventional adhesive tape with the performance of structural epoxy adhesive, providing greater design flexibility and creating a superior dual-action structural adhesive film that outperforms many liquid epoxy adhesives in the same classification.

The advanced adhesive formulation provides exceptional structural bonding and sealing properties to dissimilar materials, including high strength steel, aluminium, magnesium, high temperature plastics, composites and oily steel.

  • Double-sided high tack dual action structural bonding tape for multi-material bonding.
  • Featuring two differential sides, one high tack adhesive for initial positioning, the second with a low tack (or no tack) adhesive for close fitting components to slide into place before the structural bond is formed.

Tecman offers this summary of DAAT technology:

  • Simplified application with no issues with open time or controlling adhesive slump
  • Low cost curing with rapid cure times
  • High green strength enabling instant adhesion between differential materials
  • Multi material bonding including high strength steel, aluminium, composites and oily steel
  • Controlled bond line maintains a consistent adhesive thickness and defined bonding area
  • Adaptable technology which can be modified to include various characteristics and specific design requirements.

Brian Wall

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Tecman Speciality Materials


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