Of late, DELO has been enjoying solid growth rate in the field of automotive electronics, as well as aerospace and consumer electronics.
As Dr Wolf-Dietrich Herold, managing partner of DELO, has stated: "We not only grew considerably in the last year, but have doubled our sales figures within the last five years…"We are thus laying the foundation for an organic, profitable and sustainable growth."
All signs at DELO are still pointing to internationalisation and an extension of capacities, it adds. During the last fiscal year, the company prepared the establishment of a Japanese representation, and now also has partners in Mexico, Brazil, Turkey, Thailand and the Philippines, which will intensify the activities in these countries.
Meanwhile, DELO has developed new glob top adhesives featuring optimised flow properties. They allow chips, for example in MEMS sensors, to be coated in a uniform thickness of less than 100 µm that does not extend beyond the chip edges.
Increasing miniaturisation in microelectronic packaging gives rise to new demands on the glob top materials used. For example, manufacturers of mobile phones are now demanding a maximum thickness of 0.6 mm for MEMS packages. That means that the die coating materials used to protect the chip upper side have to be as flat as possible.
“The use of DELO heat-curing acrylates yields convincing results, “it stats, “especially when a uniform and reliable coating that does not flow beyond the chip edges is to be applied to the upper side of chips.”
Adhesives developed by DELO have a low viscosity and special flow properties. “They can thus be processed efficiently by jetting and, compared to conventional die coating materials, make it possible to achieve a homogenous flat surface with a layer thickness of less than 100 µm using just a few drops. A further benefit is the high flexibility (Shore hardness A60) reducing the risk of stresses in the chip and the wires.”
In addition to the small coating thicknesses, there is another positive aspect, says DELO: the black-coloured adhesive not only protects and preserves the chip surface, but also covers its logic structures. “This special black-coloured adhesive also makes it possible to perfectly cover the chip corners where the layer is particularly thin. Another advantage is that the optimised flow properties allow a wide range of chip sizes to be coated.”
