7 + 1 Epoxy-Tapes: Unique possibilities for structural bonding

The "Bonding Engineers" from Lohmann have solutions to help the trend towards electro mobility and weight reduction. The latest development is a family of epoxy tapes, DuploTEC® 106xx SBF, suitable for the structural bonding.

Two different adhesive variants are available as tapes, one is available in seven thicknesses: 35 μm, 70 μm, 100 μm, 125 μm, 200 μm, 630 μm, 1 mm and 2 mm. They possess a strong initial tack and can therefore be pre-applied. Curing takes place at temperatures above 130 ° C.

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