Hönle to showcase LED Spot IC range at Bondexpo 2023

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Hönle is to use Bondexpo 2023 in Germany to present its LED Spot IC product range, which is used for bonding and fixing components in manufacturing processes.

Hönle

The LED Spot IC curing devices are available in wavelengths of 365, 385, 395, 405 and 460 nm and can therefore be tailored to the respective application. The arrangement of the LEDs and an electronic power control are said to ensure an intensive and homogeneous light distribution, resulting in fast and reliable curing.

Depending on the wavelength, the LED Spot 100 HP IC has intensities of up to 5,000 mW/cm². The square light aperture measures 100 x 100 mm. If larger areas are to be irradiated, several LED Spots 100 IC can be lined up in a modularly.

The LED Spot 200 HP IC also achieves intensities of up to 5,000 mW/cm². With a rectangular light aperture of 200 x 50 mm, it is claimed to be the missing link between narrow line and square area curing units. It is also suitable for the modular juxtaposition of several devices.

With a light aperture of 40 x 40 mm, the LED Spot 40 IC enables high intensities of up to 10,000 mW/cm². With its compact design, it is used where, for example, several adhesive spots need to be cured simultaneously or large diameters are to be irradiated for which LED point sources are no longer sufficient.

All LED Spot IC curing devices are supplied and controlled either directly by an external power unit and the customer's PLC or by the optionally available LED powerdrive IC.

Bondexpo 2023 will take place from 10-13 October at Messe Stuttgart.